APxF Rev K3 Custom Printed Circuit Boards

The University of Wisconsin‑Madison is seeking competitive bids for 100 custom‑manufactured APxF Rev K3 printed circuit boards (PCBs) to support a research‑and‑development project in the Department of Physics. Bidders must demonstrate capability to fabricate high‑performance, multi‑layer boards to strict IPC Class 2 standards, provide full electrical testing (netlist and TDR), and meet delivery expectations of partial shipments with the first ~8 pieces delivered as soon as possible and the balance within a 4‑5‑month window after order receipt. The solicitation requires completion of vendor information forms, client references, compliance certifications, and acceptance of the university’s standard terms and conditions. All bids must be submitted electronically via the ShopUW+ Sourcing Module by the July 20, 2026 deadline. • 100 PCBs, 16‑layer, 320 mm × 280 mm × 2.3 mm, mixed blind‑via and heavy‑copper layers • Materials: EM‑890K laminate (MS glass) for most layers; EM‑370/EM‑37B for heavy‑copper layers; immersion gold finish with hard gold edge • Must meet IPC‑6011/6012 Class 2, include full netlist and TDR testing, and provide warranty/quality documentation • Partial shipment of ~8 boards desired early; full delivery within ~4‑5 months after order receipt • Electronic submission required; no paper bids, mandatory buyer registration on Jaggaer