Gen-2 BPM Electronics for NSLS-II SR

The Department of Energy‑operated Brookhaven National Laboratory is seeking expressions of interest for the turnkey fabrication and assembly of 225 printed‑circuit‑board (PCB) assemblies of each of two Beam Position Monitor (BPM) part numbers (total 450 assemblies). Brookhaven will supply the full design documentation and the Xilinx U9 FPGA for each board; the vendor must provide all other labor, equipment, materials, and perform first‑article inspection before the full production run. The RFI requests detailed capability statements on inline solder‑paste inspection, pick‑and‑place inspection, reflow oven technology, 3‑D AOI, and overall in‑house versus subcontracted processes, along with lead‑time estimates and budgetary pricing. • Turn‑key PCB fabrication & assembly of 450 units (two part numbers, 225 each). • Vendor must deliver a first‑article batch of 5 pcs per part number for acceptance before mass production. • Required capabilities: SPI, pick‑and‑place inspection, vapor‑phase or N₂ reflow, 3‑D AOI, and documented quality‑system compliance (BNL‑QA‑101). • Responses due by 08:00 ET on 22 Sept 2026 via email to the Contract Specialist with “BSA RFI 480310” in the subject line. • No contract award at this stage; budgetary pricing and capability statements only.