Die Bonding and Vacuum Packaging System

The Naval Research Laboratory is seeking a die bonding and vacuum packaging system for mounting and package sealing of experimental chips to chip carrier and multi-chip module assemblies. The system must include a die bonding system and a vacuum reflow furnace. The die bonding system must be capable of automated transfer of die, placement of a variety of substrates, and flip-chip bonding. The vacuum reflow furnace must be capable of hermetic sealing of chip carriers and provide a temperature-controlled cycle for degassing, solder melt, and solder solidification. The system must be fully computer controlled and provide automated delivery of epoxy resin. • The system must have a working area of 36 x 20 inches, minimum. • The system must be capable of automated transfer of die as small as 2 x 2 mm and as large as 25 x 25 mm. • The system must support placement of a variety of substrates, including leadless chip carrier packages and a 200 mm DIA standard thickness silicon wafer. • The system must have a placement accuracy of ≤ 5 micrometers, 3σ, or less in x and y directions. • The system must have a placement rate of ≥ 200 placements/hour, minimum.