Description
The Defense Microelectronics Activity (DMEA) is seeking potential sources capable of performing in-house design, tool fabrication, and production of sheet metal enclosers utilized for data transfer. The contractor must possess the internal infrastructure and technical expertise to perform two phases: Phase 1 (Engineering & Tooling) and Phase 2 (Manufacturing & Assembly). The contractor must also comply with the R-FAR 52.219-14, Limitations on Subcontracting requirement.
• The contractor must have the ability to reserve-engineer existing physical enclosers, generate 3D CAD models, and design and fabricate the necessary progressive dies, jigs, and molds for production.
• The contractor must have the ability to utilize the fabricated tooling to stamp, form, bend, machine, and assemble the physical sheet metal enclosers.
• The contractor must perform the manufacturing entirely in-house.
• The contractor must submit a statement, not to exceed three pages, documenting their capabilities of meeting all of the requirements listed above.