Multiple Award PCB Fab and Assembly BPAs 2026-2030

The Defense Microelectronics Activity (DMEA) is seeking proposals for a Multiple Award Blanket Purchase Agreement (BPA) for Printed Circuit Board (PCB) fabrication and assembly services. The BPA will be used to support DMEA's mission to develop electronics solutions for the Department of Defense (DoD). The scope of work includes the production of developmental PCBAs for initial design and development use, prototype PCBAs for design validation, and high-quality PCBAs for use in DoD operational environments. The BPA will have a ceiling of $1,500,000.00 and will be in effect from the date of award until December 31, 2030, or until the ceiling is reached, whichever comes first. • The BPA will be competed among multiple awardees to ensure fair opportunity and to minimize non-recurring engineering (NRE) costs. • The Government reserves the right to resolicit this multiple award BPA requirement to add more BPA holders. • Prices to DMEA shall be as low as or lower than those charged to the BPA holder's most favored customer for comparable quantities and services under similar terms and conditions. • The BPA holder shall provide a schedule of unit prices for a variation in pricing for different quantities and/or re-allocation of quantities across contract line item numbers (CLIN). • The Government may issue a single RFQ to a BPA holder for follow-on production of units previously produced/procured under an order under this BPA.