Automatic Wire Bonder

The National Institute of Standards and Technology (NIST) is conducting market research to identify potential sources that can provide an automatic wire bonder. The wire bonder should be capable of bonding highly dense, very fine wires to support NIST's mission. The anticipated period of performance is expected to begin on April 1, 2026. • The automatic wire bonder should be able to support high throughput production of highly dense wire bonds for scaled memory characterization applications. • The draft Statement of Work (SOW) is attached to the notice. • NIST invites industry sources to review the notice and submit information about their capabilities and expertise. • The submission should include a company summary, notice ID, company name, address, website, and point of contact information. • The submission should also include any suggestions to improve the draft SOW and standard commercial pricing information.