Description
The Marion County is seeking bids for the procurement of chip seal aggregate for the 2026 Marion County Chip Seal Program. The program includes the supply and delivery of aggregate to a storage facility. The bid is open to all qualified bidders, and the bid documents can be obtained from the Marion County Procurement Collaboration Portal. The bid due date is January 22, 2026, at 2:00 PM PST.
• The contract will be awarded to the lowest responsive and responsible bidder.
• The bidder must submit all questions and responses via the Marion County Procurement Collaboration Portal.
• The bidder must register as a respondent and submit documents through the portal.
• The bidder must comply with all applicable laws and regulations.
• The bidder must provide all necessary documentation and information as required by the bid documents.