Sources Sought Notice for a Close Fixture for Suss Wafer Bonder

The National Institute of Standards and Technology (NIST) is seeking a universal SiC closed fixture for a Suss Wafer Bonder. The fixture should meet or exceed the minimum specifications provided, including the ability to transfer and support bonding processes for substrates of various shapes and sizes. The fixture should also be able to withstand processing temperatures up to 550°C and chamber overpressure. * The fixture should be made of new materials, with no rebuilt system components. * The fixture should be able to support bonding processes for substrates ranging from 10 mm to at least 150 mm. * The fixture should come with proper bonding plates for thermocompression, eutectic, adhesion, anodic, and fusion bonds. * The plate at the center of the universal closed fixture should be made of SiC with a flatness level compatible with Suss wafer bonder operation. * The fixture should include three clamping arms to secure the positions of 100 mm wafer stacks. * The entire fixture should be able to withstand processing temperatures up to 550°C and chamber overpressure at least 2 bar and vacuum 5.0 x 10E-5 mbar or lower.