Description
The US Air Force is seeking information from potential sources for a Printed Circuit Board (PCB) Milling System to support in-house rapid prototyping, milling, drilling, and routing of PCBs. The system must meet specific physical, functional, and performance characteristics, including a minimum resolution of 0.47 µm in the X/Y axes and 0.2 µm in the Z axis, and a repeatability/precision tolerance of ± 5 µm. The system must also feature a fully automatic tool change mechanism, sensor-controlled milling depth and width adjustment, and an integrated camera system for automatic optical fiducial recognition.
• The system must be able to process boards up to 305 mm x 229 mm x 8 mm (12" x 9" x 0.3") and accommodate substrates up to 330 mm x 250 mm x 26 mm (13" x 9.8" x 1").
• The system must include integrated CAM/system software capable of importing standard CAD data and providing step-by-step process guidance.
• The system must feature pneumatic self-cleaning functionality for the spindle and milling depth sensor.
• The system must include an integrated vacuum table system for securing flexible and rigid substrates during the milling process.
• The system must be capable of accepting a solder paste dispensing unit.