Universal Bonder

The University of Notre Dame’s Electrical Department seeks a vendor to supply a “Universal Bonder,” a semiconductor fusion‑bonding machine capable of joining substrates up to 4‑inch wafers. The purchase is a one‑time buy that includes equipment delivery, installation, on‑site validation, training, and a maintenance/support package. The university expects full technical documentation, integration with its existing bond aligner, and compliance with Indiana law and university procurement policies. • Provide a Universal Bonder with precise force, temperature, and gas‑flow control, compatible with a bond aligner. • Deliver site‑preparation documentation, perform on‑site installation, validation, and train faculty, staff, and students. • Include a comprehensive warranty, preventive‑maintenance schedule, spare‑parts, and consumables pricing in the proposal.