Rapid Thermal Annealing System

The National Institute of Standards and Technology (NIST) is seeking information from potential vendors about their ability to provide a Rapid Thermal Annealing (RTA) system that meets specific requirements. The system must be able to perform RTA according to semiconductor industry standards, meet safety and cleanliness standards for use in an ISO class 5 cleanroom, and have a temperature range of room temperature to 1200°C with a temperature stability of +/- 1°C. The system must also be able to fit in a 1m x 1m x 2m floor space and process substrates from chips to 150mm SEMI spec wafers. Some key features and requirements of the RTA system include: • Must be able to perform RTA according to semiconductor industry standards • Must meet all applicable safety and cleanliness standards for use in an ISO class 5 cleanroom • Must be able to reach temperatures of room temperature to 1200°C with a temperature stability of +/- 1°C • Must have a ramp rate of at least 100°C/s • Must be able to anneal substrates in a vacuum and in gas environments • Must be able to deliver at least 4 gases including but not limited to 5% H2 in Ar, Ar, Pure dry air (80% N2 / 20% O2), and nitrogen with digital mass flow controllers • Must be able to fit in a 1m x 1m x 2m floor space • Must be able to process substrates from chips to 150mm SEMI spec wafers • Must be able to load samples with a clamshell or tray loading system with a preference for a clamshell system