PCB FABRICATION AND ASSEMBLY OF HPSC PROCESSOR CARD

The National Aeronautics and Space Administration (NASA) is seeking a vendor to fabricate and assemble high-reliability, 22-layer Printed Circuit Boards (PCBs) for the autoNGC HPSC design IRAD. The vendor shall provide all necessary materials, equipment, and labor to manufacture six bare boards, perform component assembly on one of those boards, and deliver the final products within 20 calendar days. The vendor must comply with the latest revisions of the applicable standards, including NASA/GSFC 500-PG-8700.2.5, IPC-2221, IPC-2222, IPC-6011, and IPC-6012ES. * The contract requires the fabrication of six bare PCBs and the assembly of one fully assembled PCB. * The vendor must ensure that all fabrication, testing, and inspection processes comply with the applicable standards. * The assembled board must undergo visual inspection and other required inspections. * The vendor shall provide a Certificate of Conformance verifying that all delivered PCBs meet the requirements specified in the Statement of Work. * The vendor must package the bare and assembled PCBs in a manner that prevents physical damage, moisture ingress, and electrostatic discharge damage during transit.