Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.

The NASA/NSSC is seeking a vendor to provide photonic integrated circuit packaging services for 8 PICs. The scope of work includes wire bonding to PCB, fiber alignment and bonding of FAUs, and associated process development and engineering costs. The vendor will be required to perform various tasks such as continuous engineering alignment, non-recurring engineering, and setup for standard wire bonding and FAU fabrication. The work will be performed off-site at the vendor's facility, with in-person pickup of components and delivery of completed assemblies to NASA Ames Research Center. • The contracted vendor shall perform packaging services on NASA-provided photonic integrated circuits (PICs). • The wire bonding process uses thin wires to make electrical connections between the PIC and the printed circuit board (PCB). • The fiber bonding process involves precisely aligning and epoxy bonding the FAU to the PIC. • The vendor will be required to deliver the completed assemblies in an electrostatic discharge safe bag/tray.