Perrseus

The DARPA “Perrseus” program seeks innovative proposals to develop compact cold‑atom and ultra‑high‑Q MEMS/photonic devices that operate within microscale ultra‑high‑vacuum (µUHV) packages. The effort focuses on enabling pressure‑sensing technologies that can function at pressures below 10⁻¹⁰ mbar, integrate atomic sources, and sustain vacuum and atomic source performance for at least three years. Proposals must address system architecture, photonic interconnects, pressure‑sensor design, and a clear path to high‑volume manufacturing, while complying with CMMC Level‑2 cybersecurity requirements for any subcontractors handling CUI. The solicitation allows FFRDCs, UARCs, and national labs only as subcontractors and requires detailed technical, management, and cost volumes, including separate cost proposals for FFRDCs. Oral presentations will be scheduled after intent‑to‑propose notifications. • Develop µUHV‑compatible cold‑atom or ion‑based pressure sensors (≤10⁻¹⁰ mbar). • Design single‑mode photonic interconnects and compatible capital equipment (with justification). • Provide a 5 mL physics package that includes vacuum chamber, magnetic coils, and atomic source. • Deliver a roadmap to scalable, high‑volume manufacturing (no specific threshold defined). • Submit a comprehensive IP Management Plan, CMMC compliance attestation, and required FFRDC letters of intent. • Project period of performance implicitly spans at least 3 years of vacuum/atomic‑source reliability.