Description
DARPA’s Perrseus program seeks innovative proposals to create compact, microscale ultra‑high‑vacuum (µUHV) packages that integrate single‑mode photonic interconnects, atomic sources, and pressure‑sensor technology capable of absolute pressure measurement down to < 10⁻¹⁰ mbar and operate continuously for three years. The effort is structured in three phases (security‑setup, process development, and µUHV demonstration) with a total performance period of 42 months. Prime contractors may be commercial firms or universities; federal laboratories can only participate as subcontractors and must provide separate cost packages. Proposals must include detailed technical and cost volumes, IP management plans, and compliance with CMMC Level 2 for any CUI‑handling subcontractors. No award ceiling is disclosed; typical DARPA prototype awards run in the low‑ to mid‑million‑dollar range.
Attached files
Contact
Perrseus PS Coordinator