FY 2026 Chip Seal Project

The FY 2026 Chip Seal Project is a transportation-related bid opportunity. The project involves chip seal work, but the exact scope and details are not provided in the document. Key aspects of the bid include: • The bid number is 26000774 • The bid title is FY 2026 Chip Seal Project • The category is Transportation • The status is Open • The publication date is 10/18/2025 12:00 AM • The closing date is 11/5/2025 2:00 PM To obtain more information about the bid, interested parties can email the purchasing department or log into the Bonfire module to view open bids.