CHIPS Incentives Program ? Facilities for Semiconductor Materials and Manufacturing Equipment

The CHIPS Incentives Program seeks proposals to fund the construction, expansion, or modernization of commercial facilities that produce semiconductor materials or semiconductor manufacturing equipment. Eligible applicants include private‑sector firms, nonprofits, or consortia that can substantially finance and execute such projects, with capital investments generally below $300 million (later removed). Funding is provided via a Cooperative Agreement and is intended to strengthen U.S. semiconductor supply chains for economic and national security. Applicants must submit proposals through the CHIPS Incentives Portal by 10/29/2027. • Open to “covered entities” – private, nonprofit, or mixed consortia. • Supports facilities for fabrication, assembly, testing, advanced packaging, or R&D of semiconductors and related equipment. • No cost‑sharing required. • Funding amount varies; no ceiling specified in the notice. • Application process is electronic; questions directed to [email protected].