Silicon Nitride for sensor packaging for high temperature applications

The NASA/NSSC has a requirement for Silicon Nitride for sensor packaging for high temperature applications. They intend to issue a sole source contract to SIENNA TECHNOLOGIES, INC. under the authority of FAR 13.106-1(b)(1)(i). The government intends to acquire commercial items and services using the provisions, clauses, and procedures prescribed in FAR Part 12 and FAR Part 13. Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact. Key aspects of the job include: • Providing Silicon Nitride for sensor packaging for high temperature applications • Compliance with FAR Part 12 and FAR Part 13 • Performance located at NASA/ Glenn Research Center (GRC) • Submission of capabilities and qualifications in writing to the identified point of contact