Bond Aligner

The University of Notre Dame’s Electrical Department is seeking a high‑precision semiconductor bond aligner for research labs. The equipment must provide sub‑micron alignment, dual‑chuck substrate handling (die to 4‑inch wafers), and advanced optical viewing (top, back, through‑substrate) for both opaque and transparent materials. The contract is a one‑time purchase that includes manufacturing, delivery, installation, site acceptance testing, and a single training session for university personnel. • Technical specs: sub‑micron X‑Y‑θ motion control, optical system for multi‑side viewing, robust locking mechanism for transfer to a bonding unit. • Delivery & services: supplier to finalize specs, fabricate the system, ship FOB destination, install on‑site, perform acceptance testing, and provide one‑time comprehensive training. • Procurement timeline: questions due April 2 2026, proposal due April 3 2026 5 PM EDT, award notification April 8 2026; no pre‑bid meeting or site visit required. • Administrative requirements: NET 30 payment, extensive insurance (minimum $1 M per coverage), E‑Verify compliance, background‑check for on‑site personnel, and adherence to University communication restrictions.