Multichip Module Package for SiC Pressure Sensors

The NASA/NSSC has a requirement for a Multichip Module Package for SiC Pressure Sensors. The government intends to issue a sole source contract to SIENNA TECHNOLOGIES, INC. under the authority of FAR 12.102(a). The performance will be located at NASA/Glenn Research Center (GRC). • The NAICS Code for this procurement is 334419. • The government is seeking commercial items or services using the provisions, clauses, and procedures prescribed in FAR Part 12 for Commercial items. • Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact. • The submission deadline is 6/30/2026, at 7:00 a.m. Central Standard Time.