Description
The NGMM program is seeking innovative solutions to exercise and evaluate the early-stage release of the 3D-ADK and EDA workflow for mixed-material 3D-heterogeneously integrated (3DHI) microsystem design. The solutions should demonstrate strength in advancing the state of the art, team capability, defining the problem and current state of the art, and impact on defense and commercial use cases. The desired capabilities and expertise include experience with mixed-signal, mixed-materials design, modern multi-physics EDA tools, and 3DHI or mixed-materials 2.5D integration.
Some key points to consider:
• The NGMM program is developing new EDA capabilities and the first comprehensive multi-physics enabled 3D-ADK for the design of advanced mixed-material 3DHI microsystems.
• The program is interested in awardable solutions to exercise and evaluate the early-stage release of the 3D-ADK and EDA workflow.
• Proposed solutions should reflect a next-generation, innovative 3DHI design that provides substantial performance benefits over conventional 2D designs composed of a single material.
• Teams should have a proven track record of designing microelectronics utilizing compound semiconductors and silicon, as well as working with multiple foundries and multiple design kits to develop advanced microsystems.