Notice of Intent to Sole Source Name Brand Only model TPT HB05 Wire Bonder

The National Institute of Standards and Technology (NIST) is conducting market research to identify alternative sources for a Wire Bonder, specifically the model TPT HB05. The Wire Bonder is used for wire bonding electrical connections in quantum devices and must provide precise control over bonding force, ultrasonic power, bond time, temperature, and stage motion. The ideal Wire Bonder should support fine wire with stable, repeatable operation and accurate control of bonding parameters. • The Wire Bonder must be compatible and interchangeable with the existing NIST TPT HB05 wire bonder. • The Wire Bonder should provide the same exact bonding characteristics and capability as the existing NIST TPT HB05 wire bonder. • The Wire Bonder must have the same user experience and control as the existing NIST TPT HB05 wire bonder. • The Wire Bonder should have the same work area required for NIST's device-packaging requirements.