Reactive Ion Etcher (ICP-RIE)

The Texas A&M University System (TAMUS) is seeking bids for a reactive ion etcher (ICP-RIE) system. The system must be capable of running both F-based and Cl-based chemistries and etching Si, SiO2, and SiN in addition to metals and III-V materials. The system should be a Corial 210IL ICP-RIE system with a vacuum load-lock for up to 200mm substrates. • The system must be able to etch hard materials such as Al2O3, SiC, LiTaO3, and glasses. • The system should have automatic multistep process capability when equipped with a CCD camera laser endpoint detector. • The system must be capable of etching III-V and II-VI compounds. • The bidder must provide a complete detailed specification if bidding other than the specified item. • The bidder must confirm agreement to Net 30 payment terms and FOB Destination Freight Prepaid and Allowed or DDP shipping terms.