PVD Sputtering System

Texas State University is seeking a PVD Sputtering System for research in semiconductor integration and device development. The system should have high-power density deposition capabilities, DC, RF, and reactive sputtering deposition capabilities, and a minimum of a 6-gun sputter flange. The system must be UHV compatible, have load-lock integration capability, and support various rotation speeds for the substrate platens. The university is looking for a system that can accommodate 6” substrates, has heated capabilities ranging from 350 to 800 °C, and has RF bias capability for pre-cleaning the substrate prior to deposition. • The system will be used for depositing and growing various materials as contact metals, dielectrics, spacers, and semiconductors. • The depositing process will involve DC sputtering, RF sputtering, and reactive sputtering processes. • The system must have a real-time controller that operates independently of the Windows software, ensuring that the recipe continues even if the software or computer malfunctions. • The system should support unlimited recipes with user security level features. • A chart recorder and data logging feature must be included.