High-Performance 3D Digital Image Correlation (DIC) System

The National Institute of Standards and Technology (NIST) is conducting market research to identify potential sources of commercial products/services that can provide a High-Performance 3D Digital Image Correlation (DIC) System. This system should be capable of precise, in-situ, full-field displacement and strain measurement under various thermal and mechanical loading conditions. The system must include a core 3D DIC system, fields of view and resolution, speckle-free measurement capability, and environmental chambers for in-situ measurement. Some key features and requirements include: • Measurement principle: Full-field, non-contact, high-resolution 3D Digital Image Correlation (DIC) • Cameras: At least two high-resolution digital cameras (5.0 Megapixels or greater, monochrome preferred) synchronized for stereoscopic measurement • Lenses: A set of interchangeable lenses to cover the required fields of view • Accuracy: Capable of achieving an out-of-plane measurement sensitivity (Z-axis displacement) of ±15 μm or better over the largest required Field of View (FOV) • Data output: Must provide full-field 3D displacement (U, V, W) and strain maps (εxx, εyy, εxy, Von Mises strain) The system will be used for in-situ monitoring of package and assembly deformation during service cycles to characterize the thermo-mechanical reliability of advanced electronic packaging.