Sources Sought Low Temp Anodic Bonding Glass Wafers

The National Institute of Standards and Technology (NIST) is seeking information on vendors that can provide Low Temperature Anodic Bonding Glass Wafers. The wafers should have a thermal expansion coefficient similar to Si and be able to withstand low temperature anodic bonding at below 250 C. The required specifications include a polished 4-inch diameter wafer with a thickness of 0.7 mm and 3 mm available. The vendor should provide a capability statement that includes the company name, country of origin or manufacture, and any other relevant information. • The vendor should be able to provide a specification sheet and examples of products that meet the requirements. • The vendor should be able to demonstrate experience in meeting the requirements of this procurement. • The vendor should provide information on the typical lead time to deliver the product after receipt of order. • The vendor should provide any other relevant information that is not listed above that the Government should consider in developing its minimum specifications and finalizing its market research.