Request for Information for Silicon/Germanium Epitaxial Wafers

The National Institute of Standards and Technology (NIST) is requesting information from industry to determine the availability and capability of businesses to provide Silicon/Germanium Epitaxial Wafers. The wafers are required for the NIST CHIPS Metrology program, which develops and advances cutting-edge metrology capabilities for the US semiconductor manufacturing ecosystem. The request includes seven line items with different specifications, including "Thin" Si and SiGe layers on Si, "Thick" doped Si on Si, and Isotopically enriched 28Si on Si. The vendors are expected to provide input on the requirement and the practicability of Firm-Fix pricing for all the listed line items. Some key points to consider: • The wafers are required to have specific compositions, thicknesses, and dopant levels. • The vendors should be able to provide high-quality epitaxial film stacks on silicon wafers. • The contract includes base line items with full wafer specifications and optional line items with configurable parameters. • The deliverables are due within 20 weeks of award or option modification.