APxF Rev K3 Assembly and Reflow

The University of Wisconsin‑Madison is seeking a qualified vendor to perform the assembly and solder‑reflow of APxF Rev K3 printed circuit boards (PCBs). The work consists of three phased build runs (approximately two months apart) covering a total of 99 PCBs, with the university supplying all components. The vendor must meet IPC Class 3 quality standards, use lead‑free jet‑printed solder, operate a minimum 10‑zone nitrogen reflow oven, and provide detailed pricing that includes three setup charges, a programming NRE charge, and all shipping, tariff, and import‑of‑record costs. The bid must be submitted electronically through the ShopUW+ Sourcing Module by the deadline, and the vendor must be registered in the JAGGAER system. • Scope: Assemble and reflow 99 high‑complexity, 16‑layer PCBs (APxF Rev K3) in three separate runs. • Technical Requirements: IPC Class 3, lead‑free jet‑printing, ≥10‑zone nitrogen reflow oven, blind‑via and via‑in‑pad plating, strict solder‑free unused via policy. • Pricing: Lump‑sum quote (including setup, NRE, shipping, tariffs, and importer‑of‑record details); net‑30 payment terms after successful acceptance testing. • Vendor Obligations: Provide vendor information form, past‑performance references, certifications (MBE/DVB/WBE if applicable), and accept the DOA‑3054 standard terms and conditions.