Hydrofluoric Acid Vapor Etcher

The National Institute of Standards and Technology (NIST) is conducting market research to identify potential sources of commercial products/services that can provide a Hydrofluoric Acid Vapor Etcher. The etcher should be able to process up to 150 mm substrates and meet specific requirements, including being made of materials compatible with HF, meeting industry safety requirements, and being able to perform HF vapor etch as per semiconductor industry standards. • Must be made of materials compatible with HF • Must meet all industry safety requirements for storing, processing, and maintaining 48 % HF • Must be able to perform HF vapor etch as per semiconductor industry standards • Must use HF liquid, HF gas is not acceptable • Must be compatible for use in an ISO class 5 cleanroom • Must be able to accommodate samples with sizes from chips to 150 mm SEMI spec wafers • Must be able to both mechanically clamp and secure substrates with an electrostatic chuck or holder • Must be able to heat samples from ambient to 60 C with appropriate temperature control • Must be a tabletop unit that can fit into a standard size chemical fume hood