APxF Rev K3 Assembly and Reflow

The University of Wisconsin‑Madison is seeking competitive bids to supply and perform assembly and reflow of the APxF Rev K3 printed circuit board. The solicitation is posted online and must be completed electronically by the due date. No attachments or detailed specifications are included in the excerpt, but the NIGP code indicates the work involves modular printed circuit board (PCB) assembly. This is a straightforward procurement of a specific hardware component, likely requiring a vendor with PCB assembly capability, quality control, and the ability to meet the university’s delivery schedule. • Bid opens 10/01/2026; questions due 10/08/2026; submission due 10/09/2026. • Product: APxF Rev K3 Assembly and Reflow (PCB). • Required capability: PCB manufacturing, component placement, solder reflow, testing/inspection. • Procurement via online portal (SciQuest). • Primary contact for questions: Eric Thompson ([email protected]).