Montana Microfabrication Facility Chip Bonding Tool

The Montana Microfabrication Facility is purchasing a tool for chip bonding to assemble and package photonic integrated circuits (PICs) and related devices. The tool must have precise and repeatable alignment, controlled placement, bonding force, and programmable temperature ramps. The facility requires a tabletop system with manual and semiautomatic control, a die attach and flip-chip system, and a dispensing system. The supplier must have similar products at least three US R-1 institutions or similar facilities and be able to provide two references from R-1 institutions. • The tool must have a XY table with at least 100 mm x 100 mm travel • The tool must have the ability to control chip theta rotation up to a full rotation • The tool must have flip-chip capability • The tool must have active bond force control during assembly • The tool must have min force <50g, max force >2500g • The tool must have sub-micron placement accuracy • The tool must have a dispensing system included • The tool must have at least one pick up tool included • The tool must have tool heating to at least 400 C • The tool must have plate heating to at least 400 C