TECHNOLOGY LICENSING OPPORTUNITY: Electroplated Materials and Array Design for Scintillators

This technology licensing opportunity is for the development of electroplated materials and array design for scintillators. The technology enables the fabrication of dense, high-resolution scintillator grid arrays with micron-level precision, suitable for advanced radiation detection and imaging applications. The process works by electroplating high-Z metals onto a substrate, followed by hot isostatic pressing to form solid bonded structures. This approach eliminates chemical hazards, improves feature uniformity, and supports complex geometries. The technology has various market applications, including medical imaging, homeland security, industrial inspection, and nuclear energy monitoring. • Enables high-resolution grid fabrication from high-Z metals • Avoids toxic and hazardous chemicals associated with traditional etching • Supports scalable production of precision-aligned, high-Z scintillator arrays with low material loss • Provides micron-level dimensional control and uniformity • Compatible with multiple scintillator materials and array configurations • Adaptable to custom geometries for specialized imaging or detection applications