Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture - Combined Sources Sought Notice/ Notice of Intent to Sole Source

The National Institute of Standards and Technology (NIST) is seeking a research and development (R&D) partner to fabricate micro-sized specimens of electroplated copper films and lead-free solder for mechanical testing to fracture. The partner will work closely with NIST to design and fabricate the specimens, which will be used to measure the micromechanical properties of these materials. The partner will also be required to transfer their specimen fabrication methods and knowledge to NIST. The period of performance is for a funded base period of 2 years, followed by one unfunded option period of 1 year. • The R&D partner will fabricate micro-sized specimens from both electroplated Cu films and Sn-Ag-Cu (SAC) solder. • The specimens will have variations in their geometries and dimensions, as designed by NIST. • The partner will characterize the specimens' chemical composition and microstructure, and tailor the composition and microstructure to be similar to Cu hybrid bonds and solder microbumps used in industry for heterogeneous integration. • The partner will be required to have cleanroom fabrication capabilities, microelectronics packaging and solder processing capabilities, and materials characterization capabilities. • The partner will be required to have at least 10 years of experience working on and leading R&D projects that involve sensitive data.