Description
The National Institute of Standards and Technology (NIST) is seeking information from manufacturers capable of providing a high-throughput high-resolution X-ray laminography/tomography system for advanced packaged semiconductor devices and substrates. The system must be able to resolve 1 μm metal/non-metal line and space pattern while operating with a scan speed of at least 0.5 mm3/min. The system should also be able to operate in XCL mode and provide equal or higher spatial resolution at slower scan speed compared to XCL mode when operating in XCT mode. The X-ray source must have a spot size small enough for sub-micrometer spatial resolution scans, and the X-ray detector must have at least 13 megapixels. The system must provide automatic sample handling for samples up to 100 mm × 100 mm × 20 mm and be capable of measuring any region of a 300 mm diameter sample. The system must also include instrument control capabilities, reconstruction computers and software, and safety features to protect users from unintentional exposure to ionizing radiation.
• The system must be able to resolve 1 μm metal/non-metal line and space pattern while operating with a scan speed of at least 0.5 mm3/min.
• The system should be able to operate in XCL mode and provide equal or higher spatial resolution at slower scan speed compared to XCL mode when operating in XCT mode.
• The X-ray source must have a spot size small enough for sub-micrometer spatial resolution scans.
• The X-ray detector must have at least 13 megapixels.
• The system must provide automatic sample handling for samples up to 100 mm × 100 mm × 20 mm.
• The system must be capable of measuring any region of a 300 mm diameter sample.
• The system must include instrument control capabilities, reconstruction computers and software, and safety features to protect users from unintentional exposure to ionizing radiation.
Attached files
The solicitation documents live at the source — open the bid source above to download them.
Contact
Tracy Retterer