CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates

The National Institute of Standards and Technology (NIST) is seeking a high-throughput high-resolution X-ray laminography/tomography system for advanced packaged semiconductor devices and substrates. The system should be able to operate in both XCL and XCT modes, with higher spatial resolution and faster scan speeds in XCT mode. The contractor will be responsible for delivering, installing, and providing warranty and service contracts for the system. The evaluation criteria include technical capability, prior demonstrated experience, and price. • The system must meet the requirements outlined in the Statement of Work document. • The contractor must provide a firm-fixed-price quotation for each line item. • The contractor must have an active registration in the System for Award Management (SAM) at the time of quotation submission and throughout the performance of the contract. • The contractor must submit a small business subcontracting plan if they are not certified as a small business.